Assembly, Test & Engineering Services

Assembly Capabilities

• Turn Key
• Through-Hole – Wave & Manual
• SMT – Manual, Pick & Place
• Wire-Bond
• Crimp
• RoHS

Assembly Finishing

• Conformal Coat – UR, Acrylic, Parylene, Flouropel
• Potting – Stycast, Eccobond, 3M
• Injection Molding
• Over molding
• Glop Top
• Heat Forming
• Heat Sinks

Engineering Services

• Flex Circuit Design
• Drawings / Documentation Creation
• Polar Impedance Modeling & Design
• CAD/CAM, DXF, Gerber, ODB++-, Step files
• DRC & DFMA Tools
• On-Site Design / Application Review
• Full Turn-Key services for conversion of cable harnesses to Flex/Rigid Flex
• Material Evaluation & Recommendations
• S.I. Analysis & Simulation
• Cadence Allegro
• Frontline Genesis
• Solidworks

Engineering Stack Up Generator

• By Analyzing your data and needs our team can create a stack up that best utilizes materials and processes to meet all of your electrical and mechanical needs.

Low Cost Assembly

Manufacturing Backdrilling

• By removing the unused portion of copper from the barrel of Plated Through Holes used for high-speed signal lines the signal quality can be increased by reducing the attenuation caused by the excess copper in the barrel.
• Primarily used on backplanes this practice has started to become more common on Daughtercards and Rigid-Flex.

Impedance Modeling from empirical data

Test Capabilities

• Impedance Testing
• Hi-Pot up 5,000 VDC 2,000 + test points per circuit
• Insulation resistance up to 1,000 VDC
• Four-Wire Kelvin .001Ω to 1 MΩ
• Functional Testing
• Bed of Nails, Flying Probe Panel & Layer Test
• Assembly Test Fixtures Built In-House
• Flexibility Cycling
• Environmental Testing – Thermal, HATS

Thickness vs Plating Capability and Aspect Ratio

Quick Turn